LOCTITE 3621, Epoxy, Surface mount adhesive
LOCTITE® 3621
Description
LOCTITE® 3621 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Particularly suited where dispense speeds greater than 35,000 dots/h are required. LOCTITE 3621 has been used successfully in lead free processes with water and alcohol based fluxes under conditions outlined in the Environmental Resistance section.
-One component – requires no mixing
-Very high dispense speed
-High wet strength
Technical Specifications
Cure Schedule Temperature (Step 1): 150
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1) Max: 120
Cure Schedule Time (Step 1) Min: 90
Cure Schedule Time Unit (Step 1): sec.
Cure Type: Heat Cure
Number of Components: 1 Part
Physical Form: Gel
Shear Strength Unit, Grit Blasted Steel: MPa
Shear Strength, Grit Blasted Steel: 2175
Storage Temperature Max: 8
Storage Temperature Min: 2
Storage Temperature Unit: °C
Technology: Epoxy
Viscosity Max: 3
Viscosity Min: 0.5
Viscosity Unit: Pa∙s
