UV 3C

UV Laser Marking

Description

1. Applicable to a wide range of materials.
2. Good beam quality, small focused laser spot, enabling super-fine marking.
3. Small heat-affected zone, avoiding damaging the material; high yield rate.
4. High marking speed, high efficiency and high precision.
5. No consumables are required, thereby reducing cost and maintenance expenses.
6. Overall performance is stable, suitable for continuous long-time operation.
7. Rotary worktable is used for marking.

UV-3C UV Laser Marker is based on 355nm UV laser of which Han’s Laser holds independent intellectual property right and USA invention patent. The focused laser spot of 355nm UV laser is extremely small, and the heat-affected zone is also very small, so the laser is mainly applied to super-fine marking, and marking and engraving of special materials. In addition, rotary worktable and Z-axis manual lift mechanism are used in UV-3C UV Laser Marker.

Application:

1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
4. Removal of metal or non-metallic coatings.
5. Silicon wafer micro-hole and blind hole processing.
6. Marking of low-voltage apparatus and refractory materials.

 

Technical Specifications

Machine modelUV-3C
Laser wavelength355nm
Laser power3W / 20KHz
Repetition frequency10-200KHz
Marking range100mm*100mm
Marking line width≤0.01mm
Marking depth≤0.01mm
Min. character0.06mm
Marking linear speed≤7000mm/s
Repeatability±0.003mm
Power supply requirement220V/single-phase/50Hz/15A
Total power≤1KW
Main machine system dimension845x950x1630mm
Cooling system dimension485x580x270mm

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