UV Laser Marking
UV 3C
Description
1. Applicable to a wide range of materials.
2. Good beam quality, small focused laser spot, enabling super-fine marking.
3. Small heat-affected zone, avoiding damaging the material; high yield rate.
4. High marking speed, high efficiency and high precision.
5. No consumables are required, thereby reducing cost and maintenance expenses.
6. Overall performance is stable, suitable for continuous long-time operation.
7. Rotary worktable is used for marking.
UV-3C UV Laser Marker is based on 355nm UV laser of which Han’s Laser holds independent intellectual property right and USA invention patent. The focused laser spot of 355nm UV laser is extremely small, and the heat-affected zone is also very small, so the laser is mainly applied to super-fine marking, and marking and engraving of special materials. In addition, rotary worktable and Z-axis manual lift mechanism are used in UV-3C UV Laser Marker.
Application:
1. Marking of electronic products’ LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
4. Removal of metal or non-metallic coatings.
5. Silicon wafer micro-hole and blind hole processing.
6. Marking of low-voltage apparatus and refractory materials.
Technical Specifications
Machine model | UV-3C |
Laser wavelength | 355nm |
Laser power | 3W / 20KHz |
Repetition frequency | 10-200KHz |
Marking range | 100mm*100mm |
Marking line width | ≤0.01mm |
Marking depth | ≤0.01mm |
Min. character | 0.06mm |
Marking linear speed | ≤7000mm/s |
Repeatability | ±0.003mm |
Power supply requirement | 220V/single-phase/50Hz/15A |
Total power | ≤1KW |
Main machine system dimension | 845x950x1630mm |
Cooling system dimension | 485x580x270mm |