Description
LOCTITE® 348 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited for applications where medium to high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required.
-One component – requires no mixing
-Positive under UV light
-High wet strength
Technical Specifications
Cure Schedule Temperature (Step 1): 150
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1) Max: 120
Cure Schedule Time (Step 1) Min: 90
Cure Schedule Time Unit (Step 1): sec.
Cure Type: Heat Cure
Number of Components: 1 Part
Physical Form: Gel
Shear Strength Unit, Grit Blasted Steel: MPa
Shear Strength, Grit Blasted Steel: 9.99
Storage Temperature Max: 8
Storage Temperature Min: 2
Storage Temperature Unit: °C
Technology: Epoxy
Viscosity Max: 5
Viscosity Min: 1
Viscosity Unit: Pa∙s
