Description
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
-High Tg
-Fast cure at moderate temperatures
-Halogen free
-Compatible with most Pb-free solders
-Stable electrical performance in temperature humidity bias
-Reworkable
-Room temperature flow capability
Technical Specifications
CTEa1 (Below Tg): 55 ppm/°C
CTEa2 (Above Tg) : 171 ppm/°C
Cure Schedule Temperature (Step 1) : 130
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1): 8
Cure Schedule Time Unit (Step 1) : min.
Tg : 102 °C
Viscosity : 394 mPa.s
