LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant
LOCTITE Eccobond UF 3811
Description
LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
-Room temperature flow capability
-Low viscosity material flows at room temperature with no additional preheating required
-High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
-Cures quickly at moderate temperatures to minimize stress to other components
Reworkable
-Good thermal cycling reliability
-Stable electrical performance under standard -Surface Insulation Resistance (SIR)
Technical Specifications
CTEa1 (Below Tg): 61 ppm/°C
CTEa2 (Above Tg): 190 ppm/°C
Cure Schedule Temperature (Step 1): 100
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1) : 60
Cure Schedule Time Unit (Step 1): min.
Tg : 124 °C
Viscosity : 354 mPa.s (cP) Brookfield
