ASM-K350 III
Developed to carry out the Solder Measuring Issue
Not only Point Thickness Measurement, but also apply Image Processing to Calculate Thickness Distribution Profile as well as Area Measurement
Description
‘- Prompt Solder Paste Thickness Measurement
– Thickness Profile of Section Solder Paste
– Manual 3-Dimensional Measurement (Height, Width, Length)
-Available to Measure the Covered Area and the Integrated Volume of Solder Paste
– SPC Analysis for Process Control
-Traditional ChineseEnglish (optional)Interface
-Multiple Profiles synchronism Storage
-Operating System By Windows XP
-Resolution : 3 um/pixel
