Description
Soder-Wick® offers the state of the art in desoldering technology. Soder-Wick® is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick® responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage.
All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.
FEATURES & BENEFITS
-Soder-Wick® Rosin 5′ and 10′ spools packaged in ESD-safe static dissipative bobbins
-Minimizes the risk of damage associated with static electricity
-Noncorrosive ultra high purity Type R rosin flux
-Minimizes the risk of heat damage to the board
-Will not leave ionic contamination on the boards
APPLICATIONS
–Soder-Wick® Rosin safely removes solder in all applications requiring Type ROL0 rosin flux
-BGA braid sized and designed specifically for
-BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
SPECIFICATIONS:
–MIL-F-14256 F type R flux
-NASA-STD-8739.3 Soldered Electrical Connections
-DOD-STD-883E, Method 2022
-ANSI/IPC J STD-004, Type ROL0
