Description
Chem-Wik® Desoldering Braid ensures fast and safe desoldering with ultra-pure, oxygen-free copper braid that quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage.
All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.
FEATURES & BENEFITS
-Chem-Wik® Rosin 5′ spools packaged in ESD-safe static dissipative bobbins
-Requires little or no post solder cleaning, no corrosive residues
-Optimized weave design for faster wicking and heat transfer
-Halide free
-Coated with ultra high purity, noncorrosive Type R rosin flux
-Quickly and thoroughly removes solder
-Fast wicking action protects components from harmful heat damage
APPLICATIONS
–Chem-Wik® Rosin desoldering braid safely removes solder from:
-Thru-hole Components
-Surface Mount Device Pads
-BGA Pads
-Micro Circuits
-Terminals
-Lugs and Posts
-Identification Script
SPECIFICATIONS
–MIL-F-14256F Type R
-NASA STD-8739.3 Soldered Electrical Connections
-ANSI/IPC J STD-004, Type ROL0
-DOD-STD-883E, Method 2022
