PENANG (HQ) · KUALA LUMPUR · JOHOR BAHRU

HDZ-UVC3030

PCB and Wafer Cutting

Description

1. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCB product.
2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing.
3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high.
4. The high-precision CCD positioning system can ensure the product’s processing precision.

Equipment, tools, chemicals, and technical solutions for electronics, automotive and medical manufacturing across Malaysia since 1989.
EXPLORE
Penang (HQ)
No. 3-G-1, Desa Mutiara Phase 2, Lorong Delima 20, 11700 Penang.
+604 659 8888
EXPLORE
Kuala Lumpur
+603 8070 9909
Johor Bahru
+607 558 3328
Equipment, tools, chemicals, and technical solutions for electronics, automotive and medical manufacturing across Malaysia since 1989.
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