PCB and Wafer Cutting
HDZ-UVC3030
Description
1. With high-performance UV laser, the laser cutting heat-affected zone is small and it can more efficiently process the high-density and highly integrated PCB product.
2. The self-developed control software has functions of multiple jointed board cutting, automatic focusing and distortion compensation to achieve high-precision processing.
3. With the high-precision motion platform system and high-precision galvanometer scanner, the cutting precision is high.
4. The high-precision CCD positioning system can ensure the product’s processing precision.