Chem-Wik Rosin Flux

PCB Repair and Prototyping

Description

Chem-Wik® Desoldering Braid ensures fast and safe desoldering with ultra-pure, oxygen-free copper braid that quickly and completely removes solder from circuit boards and components. Its fast wicking action protects components from harmful heat damage.

All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.

FEATURES & BENEFITS

-Chem-Wik® Rosin 5′ spools packaged in ESD-safe static dissipative bobbins

-Requires little or no post solder cleaning, no corrosive residues

-Optimized weave design for faster wicking and heat transfer

-Halide free

-Coated with ultra high purity, noncorrosive Type R rosin flux

-Quickly and thoroughly removes solder

-Fast wicking action protects components from harmful heat damage

 

APPLICATIONS

Chem-Wik® Rosin desoldering braid safely removes solder from:

-Thru-hole Components

-Surface Mount Device Pads

-BGA Pads

-Micro Circuits

-Terminals

-Lugs and Posts

-Identification Script

 

SPECIFICATIONS

MIL-F-14256F Type R

-NASA STD-8739.3 Soldered Electrical Connections

-ANSI/IPC J STD-004, Type ROL0

-DOD-STD-883E, Method 2022

 

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