Chemask NA – Non-Ammoniated Solder Mask

Description

Chemask® NA Non-Ammoniated Solder Masking Agent is a latex and ammonia free, fast curing, peelable temporary spot mask formulated for safe use on sensitive metals. It contains high-temperature resistant compounds that protect component-free areas during wave soldering. Chemask® NA may be used to protect pins, posts, contacts and edge connections in the solder reflow oven or during conformal coating processes.

FEATURES & BENEFITS

–Will not affect gold, copper, nickel, silver and OSP finishes

-For lead-free or tin/lead processes

-Stable to 550º F (288ºC)

-Phthalate-free, low toxicity and environmentally safe

-Compatible with rosin, no-clean and water soluble flux types

-Dries tack free in 15 minutes

-Can be placed directly into pre-heat oven without waiting

-Removes easily and leaves no residue

-Non-contaminating, non-staining and noncorrosive

-RoHS compliant

APPLICATIONS

–Engineered for use with bare copper, silver, and other reactive metals

-Ideal for SMT applications