PENANG (HQ) · KUALA LUMPUR · JOHOR BAHRU

Eco-Stencil UM

Soldering/Desoldering

Category:

Description

Effectively removes all types of solder paste (e.g. water­based, RMA, no­clean, lead­free) and uncured adhesive from screens, misprinted boards and equipment. Completely safe on stencils, squeegees, and equipment surfaces. Ideal replacement for IPA cleaners, which are often prohibited because of safety and environmental restrictions on VOC emissions or waste disposal issues.

FEATURES & BENEFITS
-Quickly clean paste or uncured adhesive
-Safe for stencils, tools, misprinted boards
-Nonflammable
-Low VOC, zero GWP
-Non-ozone depleting
-Compatible with DEK Nano-ProTek coating

APPLICATIONS
-Manual stencil tool, work surface, and squeegee cleaning
-Automatic underside wipe stencil cleaning
-Batch ultrasonic cleaning
-Removes unsoldered leaded & lead-free solder pastes
-Cleans off uncured adhesives

Equipment, tools, chemicals, and technical solutions for electronics, automotive and medical manufacturing across Malaysia since 1989.
EXPLORE
Penang (HQ)
No. 3-G-1, Desa Mutiara Phase 2, Lorong Delima 20, 11700 Penang.
+604 659 8888
EXPLORE
Kuala Lumpur
+603 8070 9909
Johor Bahru
+607 558 3328
Equipment, tools, chemicals, and technical solutions for electronics, automotive and medical manufacturing across Malaysia since 1989.
Copyright © 2026 Chiptronics (M) Sdn. Bhd. (199001004379)(195946-U). All rights reserved.