Description
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
-One component
-High dispense speed
-High wet strength
Technical Specifications
Cure Schedule Temperature (Step 1): 100
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1): 30
Cure Schedule Time Unit (Step 1): min.
Cure Type: Heat Cure
Number of Components: 1 Part
Physical Form: Paste
Shear Strength Unit, Grit Blasted Steel: MPa
Shear Strength, Grit Blasted Steel: 13.99
Storage Temperature Max: 8
Storage Temperature Min: 2
Storage Temperature Unit: °C
Technology: Epoxy
Viscosity Max: 4
Viscosity Min: 1
Viscosity Unit: Pa∙s
