Description
LOCTITE® ECCOBOND UF 3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.
-High Tg
-Reworkable
-Room temperature flow capability
-Fast cure at moderate temperatures
-Minimal stress on other components
-Compatible with most Pb-free and halogen-free solders
-Stable electrical performance in temperature humidity bias
CTEa1 (Below Tg) : 52 ppm/°C
CTEa2 (Above Tg) : 188 ppm/°C
Cure Schedule Temperature (Step 1) : 130
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1) : 8
Cure Schedule Time Unit (Step 1): min.
Tg : 69 °C
Viscosity : 375 mPa.s
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