Description
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
-High Tg
-Low CTE
-Reworkable
-Room temperature flow capability
-Fast cure at moderate temperatures
-Halogen free
-Compatible with most Pb-free solders
-Stable electrical performance in temperature humidity bias
Technical Specifications
CTEa1 (Below Tg): 55 ppm/°C
CTEa2 (Above Tg): 171 ppm/°C
Cure Schedule Temperature (Step 1): 130
Cure Schedule Temperature Unit (Step 1): °C
Cure Schedule Time (Step 1): 8
Cure Schedule Time Unit (Step 1): min.
Tg : 113 °C
Viscosity : 360 mPa.s
