Description
Silicone-Free Heat Sink Compound draws heat away when applied to a component.
Also known as thermal grease, thermal paste thermal compound, CPU grease, heat paste, heat sink paste, and thermal interface material.
In electronics, heat sink compound is generally used to thermally bond a component with a mechanical heat sink. For electrical applications, it is used with thermocouple wells, thermistors, and calrods, or wherever efficient cooling is required.
Ideal for electronic applications where silicone contamination hurts solderability and increase solder defects.
FEATURES & BENEFITS
-Thermal conductivity – 0.92 W/m-K
-Functional temperature range -40°F to 392°F (-40°C to 200°C)
-Non-ozone depleting
-Avoid solder defects due to silicon contamination
-Easy application
-Will not separate
-Will not harden and crack
