Description
Soder-Wick® No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.
All wick is sealed in nitrogen-purged packaging to avoid corrosion and loss of performance from moisture and oxygen.
FEATURES & BENEFITS
-Soder-Wick® No Clean packaged in ESD-safe static dissipative bobbins
-Minimizes the risk of damage associated with static electricity
-Patented noncorrosive, halide free, organic no-clean flux
-Desolders up to 40% faster than competitive no-clean braids and leaves boards cleaner
-Meets Bellcore TR-NWT-000078 and ANSI IPC SF-818 for Surface Insulation Resistance
APPLICATIONS
–Soder-Wick® No Clean SD safely removes solder in all applications requiring Type ROL0 flux
-BGA braid sized and designed specifically for
-BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes
SPECIFICATIONS
–MIL-F-14256 F
-NASA-STD-8739.3 Soldered Electrical Connections
-DOD-STD-883E, Method 2022
-ANSI/IPC J STD-004, Type ROL0
-Meets MIL-STD-883B, Bellcore TR-NWT-000078, ANSI/IPC J SF-818
-Meets parameters tested by the Singapore Institute of Standards and Industrial Research (SISIR) for Solderability
