Description
Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD’s got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of your .MDM M.O.L.E. libraries and compatibility with your intranet, Excel, and all ECD M.O.L.E.® profilers?
The MEGAM.O.L.E.® delivers your specifications in a sleek 7.2mm thin package with patented productivity enhancing features that will give you the edge in R&D decision making to WOW Management, Customers and your OEM-EMS QA linkage.
Features
-Provides data-rich profiles that encompass entire assemblies while characterizing the broadest mass of components possible
-1.5 million sample point memory enables 96 Runs between downloads, eliminating lost data trips to PC. Profile all day, download to your computer at night.
-USB Connectivity – One cable for uploading set-up, downloading data and battery charging
-Universal Charger (dual voltage) includes plug assortment – nothing else to buy
-M.O.L.E. Readiness Indicators. No wasted runs for a profiler that is not ready
-Instant Profile validation with the patented “OK” Test Button simplifies the evaluation process to a Go/No-Go answer.
-4 gangs of 5 quick-connect Nano Thermocouples manage the organization of the sensor wires
-Thermal barrier and thermocouple adaptation solutions available for a broad array of processes
-Thinnest Profiler Ever at 7.2 mm- {7″/177mm X 2.5″/63.5mm X .28″/7.2mm}
-20-Channel I/O Pod stores process and experiment set-up data so you can keep it attached to the test article, using multiple Pods with the same MEGAM.O.L.E.® module and Power Pack.
Benefits
-Elevates profiling precision of large complex boards to 20 PCB locations to satisfy OEM and R&D demands
-1.5 million sample point memory across 20 channels means no thermal profiling job is too big
-Start/Stop Recording remotely and watch the process profile live on-screen with the MEGAM.O.L.E.® RF option
-Indispensible for low-clearance lamination and metallization, wide conveyors, economical wafer instrumentation, large & complex PCBs, vacuum and inerted ovens and heat treating furnaces
-Engineer sets Slope, Soak, TAL and Peak specs in M.O.L.E.® MAP Target 10 which drives “OK” button result for operator’s ease of use
-Powers MEGARIDER™ PTP® series Process Pallets too!
